Alumina IDE

Au/Ti

₹2000.00₹1500.00

KEY HIGHLIGHTS

High-Precision Alumina-Based IDE Fabrication
Fabricated using advanced thin-film deposition (Au/Ti) on alumina substrates, ensuring superior mechanical strength, thermal stability, and highly uniform electrode geometry with tight process control.

Optimized Electrode Design
Precisely engineered 200 µm finger width and spacing to deliver stable electric field distribution—ideal for reliable impedance, capacitance, and dielectric measurements.

High Thermal & Chemical Stability 
Alumina substrate offers excellent resistance to high temperatures, harsh chemicals, and aggressive environments, making it suitable for demanding sensing conditions.

Stable & Low-Noise Electrical Performance
Designed for high signal integrity, minimal noise, and repeatable measurements, ensuring consistency across experiments and long-term testing.

Seamless Integration with Measurement Systems
Fully compatible with LCR meters, impedance analyzers, and custom electronics, enabling straightforward plug-and-measure operation.

Compact & Robust Chip Design
10 mm × 10 mm form factor with optimized layout and contact pads—ideal for lab setups, compact modules, and integration into sensing platforms.

Reliable Contact Pads for Consistent Connectivity
Engineered 1.5 mm × 1.5 mm contact pads ensure stable electrical interfacing with probes, clips, or connectors—reducing contact resistance variability.

Enhanced Durability for Repeated Use
Alumina’s rigidity and thermal resilience enable repeated coating, cleaning, and testing cycles without substrate degradation.

High Repeatability for Research & Prototyping
Ensures device-to-device consistency, critical for reproducible experiments, publications, and scalable sensor development.

Versatile for Advanced Applications
Suitable for gas sensing, VOC detection, high-temperature sensing, material characterization, dielectric studies, and harsh-environment electronics.

Built for Engineers & Research Labs
Removes fabrication variability and accelerates development—so you can focus on data, performance, and innovation instead of process limitations.

  • Electrode Material: Au/Ti

  • Substrate: Alumina

  • Finger Width: 200 µm

  • Finger Spacing: 200 µm

  • Number of Fingers: 9

  • Contact Pad Area: 1.5 mm x 1.5 mm

  • Substrate Size: 10 mm x 10 mm